- Initial Market Valuation: The global 3D ICs (Integrated Circuits) market was valued at US$ 7452.9 million in 2022.
- Projected Growth: By 2030, it is expected to reach US$ 18620 million, indicating a substantial growth trajectory.
- Compound Annual Growth Rate (CAGR): The market is poised to grow at a robust CAGR of 14.0% throughout the forecast period.
- Technological Advancements: Continuous advancements in semiconductor manufacturing techniques, particularly in stacking and interconnecting multiple layers of integrated circuits, are driving the growth of the 3D ICs market.
- Demand for Higher Performance: Increasing demand for higher performance, smaller form factor, and energy-efficient electronic devices is fueling the adoption of 3D ICs across various industries such as consumer electronics, automotive, healthcare, and telecommunications.
- Advantages of 3D ICs: 3D ICs offer advantages such as improved performance, reduced power consumption, and enhanced functionality compared to traditional 2D ICs, contributing to their growing popularity.
- Applications: 3D ICs find applications in a wide range of devices including smartphones, tablets, wearables, automotive ADAS systems, medical devices, and data centers.
- Geographical Influence: Regions with significant semiconductor manufacturing capabilities and strong demand for advanced electronic devices, such as Asia-Pacific, North America, and Europe, are expected to be major contributors to market growth.
- Industry Collaboration: Collaboration among industry players for research and development efforts aimed at advancing 3D IC technologies and addressing technical challenges associated with vertical integration and thermal management is expected to drive market expansion.
- Regulatory Environment: Regulatory policies and standards governing semiconductor manufacturing and safety regulations may impact market dynamics and adoption rates.
- Investment Opportunities: There are significant investment opportunities in research and development initiatives aimed at improving the performance, reliability, and cost-effectiveness of 3D IC technologies to meet evolving market demands.
Market size in 2022 | US$ 7452.9 million | Forecast Market size by 2030 | US$ 18620 million |
Growth Rate | CAGR of 14.0% | Number of Pages | 200+ Pages |
3D IC is a single chip in which all components onthe layers communicate using on-chip signaling, whethervertically or horizontally.
3D ICs refer to three-dimensional integrated circuits where multiple layers of active electronic components are vertically stacked to enhance performance and functionality.
3D Ics Market aims to provide a comprehensive presentation of the global market for 3D Ics, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D Ics. 3D Ics Market contains market size and forecasts of 3D Ics in global, including the following market information:
Global 3D Ics Market Revenue, 2018-2023, 2024-2030, ($ millions)
Global 3D Ics Market Sales, 2018-2023, 2024-2030, (K Units)
Global top five 3D Ics companies in 2023 (%)
There are four ways to built 3D ICs :- 1. Monolithic 2. Wafer on wafer 3. Die on wafer 4. Die on die
We surveyed the 3D Ics manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 3D Ics Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global 3D Ics Market Segment Percentages, by Type, 2023 (%)
Beam re-crystallization
Wafer bonding
Silicon epitaxial growth
Solid phase crystallization
Global 3D Ics Market, By Technology, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global 3D Ics Market Segment Percentages, By Technology, 2023 (%)
Through-Silicon Via (TSV)
Silicon Interposer
Monolithic 3D ICs
2.5D ICs
Global 3D Ics Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global 3D Ics Market Segment Percentages, by Application, 2023 (%)
Consumer Electronics
Information and communication technology
Transport (automotive and aerospace)
Military
Others(Biomedical applications and R&D)
Global 3D Ics Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (K Units)
Global 3D Ics Market Segment Percentages, By Region and Country, 2023 (%)
North America (United States, Canada, Mexico)
Europe (Germany, France, United Kingdom, Italy, Spain, Rest of Europe)
Asia-Pacific (China, India, Japan, South Korea, Australia, Rest of APAC)
The Middle East and Africa (Middle East, Africa)
South and Central America (Brazil, Argentina, Rest of SCA)
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies 3D Ics revenues in global market, 2018-2024 (Estimated), ($ millions)
Key companies 3D Ics revenues share in global market, 2023 (%)
Key companies 3D Ics sales in global market, 2018-2023 (Estimated), (K Units)
Key companies 3D Ics sales share in global market, 2023 (%)
Further, the report presents profiles of competitors in the market, key players include:
XILINX
Taiwan Semiconductor Manufacturing Company
The 3M Company
Tezzaron Semiconductor Corporation
STATS ChipPAC
Ziptronix
United Microelectronics Corporation
MonolithIC 3D
Elpida Memory
Comentários